Applications
The DIC systems from Correlated Solutions excel in every imaginable application.
Our digital image correlation (DIC) systems have been implemented successfully in a wide range of applications from automotive to biological, and size scales from microscopy to large structures. All DIC systems are sold as turnkey solutions, which are customized to your measurement needs. Our systems include all hardware, software, technical support, onsite installation, and equipment training. We are dedicated to providing our customers with quality technical support and free software upgrades for one year after the date you receive your system.
DIC for Rail Neutral Temperature & Stress Measurements
The proposed method is based on measurements of nonuniform deformations of the rail under thermal loading, as observed in computer simulations and laboratory investigations. The implementation uses thermal imaging and three-dimensional stereo-digital image correlation technology to acquire full-field deformations.
Strains Within a 300µm Diameter Ball Solder in BGA
The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.
NASA Buckling Test with Real Time Module
Digital Image Correlation has played a key role in the successful NASA SBKF test program. As the video footage shows, the VIC-3D system provides information that would be unimaginable with any other technology. Used in conjunction with FEA modeling, it will allow NASA to decrease weight and increase the payload of future rockets.