This paper describes a series of experiments in which truncated cone geometries were formed using two multistage methods and compared to the same geometry formed using the traditional single stage method. The geometric accuracy and thickness distributions, including 3D thickness distribution plots, of each are examined using digital image correlation (DIC).

Studying the behavior of metals during a high-speed dynamic compression event has always been challenging due to the complex test set up and fast data capture rates required. Currently, very little literature is available regarding deformation behavior at strain rates of 10 to 500s-1. Utilizing high-speed cameras, the VIC-3D HS system can be used to quantify the surface displacements and strains in three dimensions over the entire field with great precision. Digital image correlation (DIC) has gained widespread popularity over recent years in such high-speed applications due to its high accuracy, flexibility and ease of use.

The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.

A plastic gear assembly was being evaluated to better understand interactions between component parts. In addition to strain measurements, it was desirable to obtain deflection data in three dimensions.

Digital Image Correlation has played a key role in the successful NASA SBKF test program. As the video footage shows, the VIC-3D system provides information that would be unimaginable with any other technology. Used in conjunction with FEA modeling, it will allow NASA to decrease weight and increase the payload of future rockets.