Applications

The DIC systems from Correlated Solutions excel in every imaginable application.

Our digital image correlation (DIC) systems have been implemented successfully in a wide range of applications from automotive to biological, and size scales from microscopy to large structures. All DIC systems are sold as turnkey solutions, which are customized to your measurement needs. Our systems include all hardware, software, technical support, onsite installation, and equipment training. We are dedicated to providing our customers with quality technical support and free software upgrades for one year after the date you receive your system.

VIC-3D, Adhesion, Microscope, Electronics, Batteries, Pressurization, Quasi-Static Brian Harmon VIC-3D, Adhesion, Microscope, Electronics, Batteries, Pressurization, Quasi-Static Brian Harmon

Adhesion Energy of Graphene on Nickel Substrates

In this study, for the first time, a novel full-field three dimensional (3D) blister test via stereo-digital image correlation (StereoDIC) was developed to characterize the interfacial interaction between as-grown graphene on nickel (Ni) and copper (Cu) substrates, respectively.

Read More
Microscope, VIC-3D, Electronics, Strain, Metals, Welding Brian Harmon Microscope, VIC-3D, Electronics, Strain, Metals, Welding Brian Harmon

Strains Within a 300µm Diameter Ball Solder in BGA

The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small-field imaging is microelectronics. Small electronics, like ball grid arrays (BGA) seen here, are too far small for traditional DIC to provide enough resolution to obtain local strain distribution within the actual ball solder.

Read More