VIC-3D Stereo Microscope & Capacitor Chip Assembly

The VIC-3D Stereo Microscope System enables local analysis within very small elements. One industry that benefits from this small field imaging is microelectronics. Small electronics, like the ceramic capacitor chips seen here, are too small for traditional DIC to provide enough resolution to obtain local strain distribution of the capacitor chip, board, and the soldering area in between the board and chip. Here, the chip is cut in half so that the cross-section can be imaged in order to reveal the strains within the individual elements. The specimen is loaded in bending, and the stereo microscope obtains images within a 4mm field of view (FOV), in order to investigate the strains within the small region in order to reveal the local strain distribution within the different components.

Figure 1. Horizontal Exx strain distribution within board, solder and capacitor chip

Figure 2. Horizontal Eyy strain distribution within board, solder and capacitor chip

Figure 3. Shear Exy strain distribution within board, solder and capacitor chip