The proposed method is based on measurements of nonuniform deformations of the rail under thermal loading, as observed in computer simulations and laboratory investigations. The implementation uses thermal imaging and three-dimensional stereo-digital image correlation technology to acquire full-field deformations.

Understanding thermo-mechanical behavior of material can be a vital component when designing vehicles and structures that may become exposed to high temperatures. Virginia Tech’s Extreme Environments, Robotics, and Materials (ExtReMe) Laboratory focuses on the impact of extreme environments on materials. This includes research that is focused on understanding the thermo-mechanical behavior of materials both during and following fires. Experimental investigations are performed to understand the evolution of the material due to elevated temperature.

Printed circuit boards (PCBs) have two primary functions: to provide electrical connections between terminals on the board, and to affix electronic components such as resistors, capacitors, and microchips via soldering. PCBs are used in many devices around the world on a day-to-day basis. Their small and lightweight design allows them to be found in nearly every electronic device, such as smart watches, phones & computers, and even digital cameras.