Correlated Solutions offers non-contact strain and deformation measurement solutions for materials and product testing. These measurements can be made on length scales ranging from microns to meters and time scales as small as nanoseconds. Our scientists and engineers have specialized in deformation measurements for over 20 years and are recognized as world leaders and the inventors of digital image correlation. In addition to our powerful digital image correlation systems, Correlated Solutions also offers a range of measurement solutions for Laser Shearography and Vibration analysis.

Recent News

01Jun

COVID-19 Update

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Like the rest of our community, both locally and around the world, Correlated Solutions has been actively implementing necessary precautions... Read More →
29May

Thin-Walled Composite Beam Analysis with Digital Image Correlation

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Sustainable construction materials are increasingly popular around the world, and researchers at the University of Queensland’s Department of Civil Engineering... Read More →
19May

Large-scale Digital Image Correlation with VIC-3D as Bridge Repair Solution

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The scientists at the University of Virginia in collaboration with the Virginia Transportation Research Council recently utilized the VIC-3D digital... Read More →

Upcoming Shows

The Society for Experimental Mechanics (virtual) Annual Conference and Exposition on June 8-11 focuses on all areas of research and applications pertaining to experimental mechanics, and has evolved to encompass the latest technologies supporting optical methods; additive & advanced manufacturing; dynamic behavior of materials; biological systems; micro-and nano mechanics; fatigue and fracture; composite and multifunctional materials; residual stress; inverse problem methodologies; thermomechanics; and time dependent materials.

The American Society for Engineering Education Annual Conference & Exposition is the only conference dedicated to all disciplines of engineering education. This year it is being held virtually. This conference is committed to fostering the exchange of ideas, enhancing teaching methods and curriculum, and providing prime networking opportunities for engineering and technology education stakeholders such as: deans, faculty members, and industry and government representatives. The conference, from June 21-24, 2020 features more than 400 technical sessions, with peer-reviewed papers spanning all disciplines of engineering education.

While “hindsight is 20/20″, the 2020 BMES meeting on October 14-17 will focus on our future to showcase innovative developments in research and education. The theme of this meeting is to highlight biomedical engineering’s contributions to healthcare and catalyze discussion for a new decade for biomedical advances. The meeting will connect research and education communities to stimulate new strategies to advance healthcare. The meeting will be highlighted by exciting plenary speakers, research sessions, workshops, and outreach programs that will provide valuable information and opportunities to engage with the biomedical engineering community.

DIC Applications

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